Apple Delays Slimmer iPhone 17 Series and 2nm Chipset

Apple's plans for the iPhone 17 series have changed. The expected slim design using resin-coated copper (RCC) components, initially delayed from the iPhone 16, is now postponed further due to durability issues. Analyst Ming-Chi Kuo confirms RCC won't be used, leaving the timeline for slimmer iPhones uncertain. Additionally, the anticipated 2nm chipset from TSMC won't be ready until the end of 2025, pushing its debut to the iPhone 18 series in 2026. Instead, the iPhone 17 will continue using TSMC’s 3nm process node, similar to current and upcoming models.

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