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Introduction:
Google is gearing up to unveil its next lineup of hardware products later this year, anticipated to include the Pixel 9 series, Pixel Fold 2, and the rumored Pixel Tablet 2 with 5G support. A recent report suggests that these devices will receive a significant upgrade in the form of a new cellular modem, promising improved connectivity performance.
Transition to In-House Tensor Chipsets:
Previously, Google relied on Qualcomm modems, integrated within Snapdragon chipsets, for its Pixel phones. However, with the transition to in-house Tensor chipsets based on Exynos, the company has started incorporating Samsung modems into its Pixel lineup.
Challenges with Current Modems:
The existing modems on Pixel phones reportedly face issues with low connectivity and suboptimal power efficiency. In response, Google plans to equip the Pixel 9 series with a new modem, expected to deliver enhanced connectivity performance.
Tensor G4 Chipset Integration:
The new modem will be integrated with the upcoming Tensor G4 chipset, set to debut on the forthcoming Pixel hardware, including the Pixel 9, Pixel Fold 2, and Pixel Tablet 2. This move aims to address connectivity shortcomings and provide a smoother user experience.
Software-Level Improvements:
Apart from hardware upgrades, the new modem is anticipated to receive software-level enhancements, such as support for the 3GPP Rel.17 5G specification, enabling satellite connectivity. This aligns with Google's reported plans to introduce a "Satellite Gateway" app for Emergency SOS functionality.
Supplier and Specification:
Samsung will continue to supply the new modem, identified as the 5400 model, compared to the existing Tensor G3 chipset's 5300 modem. While specific hardware improvements remain undisclosed, users can expect advancements in connectivity, reliability, and power efficiency.
Also Read:Nothing Phone (2a) Receives Nothing OS 2.5.5 Update:How to Update
Future Chipset Transition:
In addition to the modem upgrade, Google is speculated to transition to Tensor chipsets produced by TSMC in 2025, suggesting ongoing efforts to enhance performance and optimize hardware integration.
As Google prepares to unveil its next hardware lineup, the integration of an upgraded modem underscores the company's commitment to delivering seamless connectivity and a superior user experience across its diverse range of products.
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