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Xiaomi Mix Flip Global Launch Nears; Mix Fold 4 and Honor Magic V3 Hardware Tipped

Aman Singh
Aman Singh
Xiaomi Mix Flip Global Launch Nears; Mix Fold 4 and Honor Magic V3 Hardware Tipped

Xiaomi Mix Flip appeared on Singapore’s IMDA database, featuring 5G, NFC, and Wi-Fi support. It may include a Snapdragon 8 Gen 3 chipset, 67W fast charging, and dual Leica-branded cameras. Additionally, the Xiaomi Mix Fold 4 and Honor Magic V3 foldables are rumored to have Snapdragon 8 Gen 3 processors and 5,000mAh batteries. The Mix Fold 4 could be the slimmest foldable with a 50MP quad-camera setup and a stronger hinge, while the Honor Magic V3 might have minimal camera bulge. Both devices are expected to debut soon.

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